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2.0mm pitch SPH-002T wire to board connector tin-plated phosphor crimp terminals

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2.0mm pitch SPH-002T wire to board connector tin-plated phosphor crimp terminals

Brand Name : HRT

Model Number : A2001-T

Certification : ISO9001/ ISO14001/UL/RoHS/REACH

Place of Origin : dongguan, China(mainland)

MOQ : 100K PCS

Price : Negotiated

Payment Terms : TT, Western Union, PayPal, L/C

Supply Ability : 100 million pcs per month

Delivery Time : 5 to 8 working days after payment checked

Packaging Details : paper tray with out carton

Pitch : 2.0mm

wire range : AWG#26 - #30

Material : Phosphor

Finish : Tin-plated or Gold-flash

Category : Terminal

Insulation O.D : 1.30mm(Max)

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1, The specification of the product including basic size information, electrical and mechanical properties.

Basic size information
Termination Interface Style Crimp or compression
Processing methods E-stamping before tin-plated or Gold-flash
Insulation O.D. 1.30mm(Max)
Part No. A2001-TPE or A2001-GPE
Application Signal, PCB borad
Electrical properties
Current Rating 2A AC, DC
Voltage Rating 100V AC, DC
Contact Resistance 10mΩ Max
Insulation Resistance 1000MΩ min
Withstanding Voltage 800V AC/minute
Mechanical properties
Temperature range -25℃ to 85 ℃
Other information please kindly check the following picture.

2 Mated Hosuing information

Product Profile
Series Wire connector A2001H-NP & A2001HB-NP
Category Wire to Board Crimp style Connectors
Type Disconnectable type
Crimp style, Thin type
Specification
Pitch 2.0 mm
Current rating 2A AC,DC(AWG#26 to #30)
Voltage rating 100V AC, DC
PC board
mounting direction
Top entry, Side entry

3, Related drawing and report

The following pictures are engineering drawing and testing report for your reference, wish these can help you to purchase the ideal and right parts from us. Thank you!

2.0mm pitch SPH-002T wire to board connector tin-plated phosphor crimp terminals

2.0mm pitch SPH-002T wire to board connector tin-plated phosphor crimp terminals

Testing report

1. Scope

This specification covers the requirements for product performance of 2.00mm pitch wire to board

connectors series.

2. Construction,Dimensions,Material & Plating

See the attached drawings

3. Ratings & Applicable Wires

Item Standard
Rated Voltage (Max.) 100V AC/DC Insulation O.D. 1.50mm (Max.)
Rated Current (Max.) And Applicable Wires AWG#24 2.0A AC/DC
AWG#26 1.5A AC/DC
AWG#28 1.0A AC/DC
AWG#30 0.5A AC/DC
Ambient Temperature Range -25℃ ~ +85℃*

*: Including terminal temperature rise

4. Electrical Performance

Test Description Procedure Requirement
4-1

Contact Resistance

Mate connectors, measure by dry circuit, 20mV max., 10mA.(Based upon JIS C5402 5.4) 10mΩ (Max.)
4-2 Insulation Resistance Mate connectors, apply 500V DC between adjacent terminal or ground. (Based upon JIS C5402 5.2/MIL-STD-202 Method 302 Cond. B) 1000MΩ (Min.)
4-3 Dielectric Withstanding Voltage Mate connectors, apply 800V AC (rms) for 1 minute between adjacent terminal or ground. (Based upon JIS C5402 5.1/MIL-STD-202 Method 301) No Breakdown.
4-4 Contact Resistance on Crimped Portion Crimp the applicable wire on to the terminal, measure by dry circuit, 20mV (Max.)., 10mA. 5mΩ (Max.)

5. Mechanical Performance

Test Description Procedure Requirement
5-1 Actuator Insertion & Withdrawal Force Insert and withdraw connectors at the speed rate of 25±3mm / minute. Refer to paragraph 7-2
5-2 Crimping Pull Out Force Fix the crimped terminal, apply axial pull out force on the wire at the speed rat of 25±3mm / minute.(Based upon JIS C5402 6.8) AWG#24 3.0kgf (Min)
AWG#26 2.0kgf (Min)
AWG#28 1.0kgf (Min)
AWG#30 0.8kgf (Min)
5-3 Terminal Insertion Force. Insert the crimped terminal into the housing. 1.00kgf (Max.)
5-4 Terminal/Housing Retention Force. Apply axial pull out force at the speed rate of 25±3mm / minute on the terminal assembled in the housing. 1.50kgf (Min.)
5-5 Pin Retention Force Apply axial push force at the speed rate of 25±3mm / minute 1.00kgf (Min.)
5-6 Latch Yield Strength

Mate connectors and pull apart until both latches break at the speed rate of

25±3mm / minute

3.00kgf (Min.)
5-7 Durability When mated up to 50 cycles repeatedly by the rate of 10 cycle per minute. Contact Resistance 20mΩ (Max.)
5-8 Vibration

Amplitude: 1.5mm P-P

Sweep time: 10-55-10 Hz in 1 minute Duration: 2 hours in each X.Y.Z. axes.

(Based upon MIL-STD-202 Method 201A)

Appearance No Damage.

Contact Resistance 20mΩ (Max.)

Discontinuity 1 μsec.(Max.)

5-9 Physical Shock 490m/s²{50G},3 strokes in each X.Y.Z. axes. (Based upon JIS C0041/MIL-STD-202 Method 213B Cond. A)

6. Environmental Performance And Others

Test Description Procedure Requirement
6-1 Temperature Rise Carrying rated current load.(Based upon UL 498) 30℃(Max.)
6-2 Heat Resistance 85±2℃,96 hours (Based upon JIS C0021/MIL-STD-202 Method 108A Cond. A)

Appearance No Damage.

Contact Resistance 20mΩ (Max.)

6-3 Cold Resistance -25±3℃,96 hours (Based upon JIS C0020)
6-4 Humidity

Temperature: 40±2℃

Relative Humidity : 90~95%

Duration: 96 hours

(Based upon JIS C0022/MIL-STD-202 Method 103B Cond. B)

Appearance No Damage.

Contact Resistance 20mΩ (Max.)

Insulation Resistance 100MΩ (Min.)

Dielectric Withstanding Voltage Must meet 4-3

6-5 Temperature Cycling

5 cycles of:

a) -55℃ 30 minutes

b) +85℃ 30 minutes

(Based upon JIS C0025)

Appearance No Damage.

Contact Resistance 20mΩ (Max.)

6-6 Salt Spray Tin-plated 12 hours / Gold- plated 24 hours exposure to a salt spray from the 5±1% solution at 35±2℃. (Based upon JIS C0023/MIL-STD-202 Method 101D Cond. B)
6-7 SO2 Gas

24 hours exposure to 50±5ppm.

SO2 gas at 40±2℃.

6-8 NH3 Gas 40 minutes exposure to NH3 gas evaporating from 28% Ammonia solution.
6-9 Solderability

Soldering Time: 5±0.5 sec.

Solder Temperature: 245±5℃

Solder Wetting 95% of immersed area must show no voids, pin holes
6-10

Resistance to Soldering Heat

(DIP)

Solder pot method

Soldering time: 10±0.5 sec.

Solder Temperature: 260±5℃

Solder iron method

Soldering Time: 5±0.5 sec.

Solder Temperature: 370℃ ~ 400℃

Appearance No Damage.
6-11 Resistance to Soldering Heat (SMT)

When reflowing

Refer to paragraph 8

Solder iron method

Soldering Time: 5±0.5 sec.

Solder Temperature: 370℃ ~ 400℃

Appearance No Damage.

7. Crimp Specifications & Actuator Insertion/Withdrawal Force

7-1 Terminals with height, suggestion pressure width and wire and terminal's retention

Wire Diameter Numbers Conductor Parts(Core Wire)mm Insulation Parts(PVC)mm
Width Height Width Height
AWG#24 A2001 1.20±0.10 0.75±0.05 1.60(Max.) 2.00(Max.)REF.
AWG#26 0.70±0.05
AWG#28 0.65±0.05
AWG#30 0.60±0.05

7-2 WITHOUT A LOCK [Unit : kgf]

Circuits At Initial Circuits At Initial
Insertion (Max.) Withdrawal (Min.) Insertion (Max.) Withdrawal (Min.)
Single 0.70 0.10 10 5.00 1.70
02 1.00 0.50 11 5.50 1.70
03 1.50 0.65 12 6.00 1.85
04 2.00 0.80 13 6.00 2.00
05 2.50 0.95 14 6.00 2.00
06 3.00 1.10 15 6.00 2.00
07 3.50 1.25 16 6.00 2.15
08 4.00 1.40 17 6.00 2.15
09 4.50 1.55 18 6.00 2.15

7-3 LOCK [Unit : kgf]

Circuits At Initial Circuits At Initial
Insertion (Max.) Withdrawal (Min.) Insertion (Max.) Withdrawal (Min.)
03 2.50 3.00 10 6.00 4.50
04 3.00 3.00 11 6.50 4.50
05 3.50 3.00 12 7.00 4.50
06 4.00 3.00 13 7.50 5.00
07 4.50 3.50 14 8.00 5.00
08 5.00 4.00 15 8.00 5.00
09 5.50 4.00 16 8.00 5.50


Product Tags:

Crimp Terminal Connector

      

Crimp Wire Connectors

      
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